Browse Patents by Publication Date

Publication Number Title
US10062641 Integrated circuits including a dummy metal feature and methods of forming the same
US10062642 Semiconductor device with inductively coupled coils
US10062643 Nickel-silicon fuse for FinFET structures
US10062644 Copper interconnect for improving radio frequency (RF) silicon-on-insulator (SOI) switch field effect transistor (FET) stacks
US10062645 Interconnect structure for semiconductor devices
US10062646 Semiconductor integrated circuit and electronic system including the same
US10062647 Interconnect structure having tungsten contact copper wiring
US10062648 Semiconductor package and method of forming the same
US10062649 Package substrate
US10062650 Semiconductor device, and semiconductor chip having chip identification information
US10062651 Packaging substrate and electronic package having the same
US10062652 Fan-out semiconductor package and method of manufacturing same
US10062653 Semiconductor device and method for manufacturing same
US10062654 Semicondcutor structure and semiconductor manufacturing process thereof
US10062655 Semiconductor device
US10062656 Composite bond structure in stacked semiconductor structure
US10062657 Method for manufacturing alloy bump
US10062658 Electronic component and electronic device
US10062659 System and method for an improved fine pitch joint
US10062660 Anisotropic conductive film including a reflective layer
US10062661 Package-on-package assembly with wire bonds to encapsulation surface
US10062662 Integrated fan-out package structures with recesses in molding compound
US10062663 Semiconductor assembly with built-in stiffener and integrated dual routing circuitries and method of making the same
US10062664 Semiconductor packaging device with heat sink
US10062665 Semiconductor packages with thermal management features for reduced thermal crosstalk
US10062666 Catch flexure systems, devices and methods
US10062667 Stacked microfeature devices and associated methods
US10062668 Semiconductor electronic device with improved testing features and corresponding packaging method
US10062669 Semiconductor device
US10062670 Radio frequency system-in-package with stacked clocking crystal
US10062671 Circuit board embedding a power semiconductor chip
US10062672 Light source module
US10062673 PC-LED module with enhanced white rendering and conversion efficiency
US10062674 Systems and methods for display formation using photo-machinable material substrate layers
US10062675 Micro-LED array display devices
US10062676 Multilayer chipset structure
US10062677 Back-to-back solid state lighting devices and associated methods
US10062678 Proximity coupling of interconnect packaging systems and methods
US10062679 Apparatuses and methods for forming die stacks
US10062680 Silicon-on-insulator (SOI) complementary metal oxide semiconductor (CMOS) standard library cell circuits having a gate back-bias rail(s), and related systems and methods
US10062681 SOI integrated circuit equipped with a device for protecting against electrostatic discharges
US10062683 Compound semiconductor transistor and high-Q passive device single chip integration
US10062684 Transition frequency multiplier semiconductor device
US10062685 Variable snubber for MOSFET application
US10062686 Reverse bipolar junction transistor integrated circuit
US10062687 Stack MOM capacitor structure for CIS
US10062688 Semiconductor device with epitaxial source/drain
US10062689 Method to fabricate vertical fin field-effect-transistors
US10062690 Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods
US10062691 Semiconductor device having contact plug and method of forming the same
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