Browse Patents by Publication Date

Publication Number Title
US10163637 Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
US10163638 High-voltage semiconductor device
US10163640 Gate isolation plugs structure and method
US10163641 Memory with a raised dummy feature surrounding a cell region
US10163642 Semiconductor device, method and tool of manufacture
US10163643 Method of forming semiconductor device using titanium-containing layer and device formed
US10163644 Interconnect structure including a conductive feature and a barrier layer on sidewalls and a bottom surface of the conductive feature and method of forming the same
US10163645 Method for processing wide-bandgap semiconductor substrate and apparatus therefor
US10163646 Method for forming semiconductor device structure
US10163647 Method for forming deep trench structure
US10163648 Method of semiconductor device fabrication having application of material with cross-linkable component
US10163649 Semiconductor structure and manufacturing method thereof
US10163650 System and method for selective nitride etch
US10163651 Structure and method to expose memory cells with different sizes
US10163652 Mechanisms for forming patterns using multiple lithography processes
US10163653 Plasma etching method and plasma etching apparatus
US10163654 Method of fabricating semiconductor device with reduced trench distortions
US10163655 Through substrate via liner densification
US10163656 Methods for dry etching cobalt metal using fluorine radicals
US10163657 Semiconductor device and method of manufacture
US10163658 Semiconductor package with multiple molding routing layers and a method of manufacturing the same
US10163659 Fin-type field effect transistor and method of forming the same
US10163660 Sensor device with media channel between substrates
US10163661 Stacked semiconductor devices and methods of forming same
US10163662 Fabrication method of semiconductor package
US10163663 Substrate processing apparatus, exhaust system and method of manufacturing semiconductor device
US10163664 Substrate cleaning apparatus and substrate cleaning method
US10163666 Temperature control system for semiconductor manufacturing system
US10163667 Linear wafer drive for handling wafers during semiconductor fabrication
US10163668 Thermal dynamic response sensing systems for heaters
US10163669 Metrology system and measurement method using the same
US10163670 Device and method for heat treating an object
US10163672 Substrate processing device, method for controlling substrate processing device, and storage medium storing programs
US10163673 Dual adhesive bonding with perforated wafer
US10163674 Circular support substrate for semiconductor
US10163675 Method and apparatus for stacking devices in an integrated circuit assembly
US10163676 Apparatus and system for preventing backside peeling defects on semiconductor wafers
US10163677 Electrically insulated fin structure(s) with alternative channel materials and fabrication methods
US10163678 Sinker with a reduced width
US10163679 Shallow trench isolation formation without planarization
US10163680 Sinker to buried layer connection region for narrow deep trenches
US10163681 Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
US10163682 Methods of forming semiconductor structures
US10163683 MOSFETs with channels on nothing and methods for forming the same
US10163684 Fabrication of silicon germanium-on-insulator FinFET
US10163685 Methods of forming one or more covered voids in a semiconductor substrate
US10163686 Thermal sensor arrangement and method of making the same
US10163687 System, apparatus, and method for embedding a 3D component with an interconnect structure
US10163688 Interconnect structure with kinked profile
US10163689 Integrated circuit with conductive line having line-ends
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