Great research starts with great data.

Learn More
More >
Patent Analysis of

Method for protecting an electronic circuit carrier against environmental influences and circuit module

Updated Time 12 June 2019

Patent Registration Data

Publication Number

US10064279

Application Number

US15/304768

Application Date

25 March 2015

Publication Date

28 August 2018

Current Assignee

ZF FRIEDRICHSHAFEN AG

Original Assignee (Applicant)

ZF FRIEDRICHSHAFEN AG

International Classification

H05K7/00,H05K5/00,H05K1/18,H05K3/28

Cooperative Classification

H05K1/181,H05K3/284,H05K2203/1327,H05K2203/0756,H05K2203/1316

Inventor

ROBIN, HERMANN JOSEF

Patent Images

This patent contains figures and images illustrating the invention and its embodiment.

US10064279 Method protecting electronic 1 US10064279 Method protecting electronic 2
See all images <>

Abstract

The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner. The method may include applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process.

Read more

Claims

1. A method for protecting an electronic interconnect device from environmental effects, wherein the electronic interconnect device is connected to at least one electronic component on both upper and lower surfaces, and wherein the electronic interconnect device and the at least one electronic component are entirely encompassed with an encapsulating material by a 3D printing process, the method comprising: heating the electronic interconnect device to a cross-linking temperature of the encapsulating material by a holding device on the surface opposite to a 3D printer; and applying the encapsulating material to an area of the electronic interconnect device with the cross-linking temperature by the 3D printer during the 3D printing process.

2. The method according to claim 1, wherein the encapsulating material is melted during the 3D printing process and applied to the electronic interconnect device with the 3D printer in drops or layers.

3. The method according to claim 1, further comprising cleaning the electronic interconnect device prior to the application of the encapsulating material.

4. The method of claim 1, further comprising the step of providing the electronic interconnect device.

5. The method of claim 1, wherein the interconnect device is disposed on a holding device during the 3D printing process, where the holding device can move the interconnect device with respect to the 3D printer.

6. The method of claim 1, wherein the interconnect device is disposed on a holding device during the 3D printing process, where the holding device is configured to heat the interconnect device to a cross-linking temperature of the encapsulating material.

7. The method of claim 1, wherein the encapsulating material is applied in layers with a varying height across a surface of the electronic interconnect device.

8. The method of claim 1, wherein the encapsulating material is heated in the 3D printer prior to being applied.

Read more

Claim Tree

  • 1
    od for protecting an electronic interconnect device from environmental effects, wherein he elec
    • ronic interconnect device is connected to at least one electronic component on both upper and lower surfaces, and wherein he elec
    • thod according to claim 1, wherein he enca
      • sulating material is melted during the 3D printing process and applied to the electronic interconnect device with the 3D printer in drops or layers. 3. The m
    • thod according to claim 1, further omprising cleaning
      • the electronic interconnect device prior to the application of the encapsulating material. 4. The m
    • thod of claim 1, further omprising the step
      • of providing the electronic interconnect device. 5. The m
    • thod of claim 1, wherein he inte
      • connect device is disposed on a holding device during the 3D printing process, where the holding device can move the interconnect device with respect to the 3D printer. 6. The m
    • thod of claim 1, wherein he inte
      • connect device is disposed on a holding device during the 3D printing process, where the holding device is configured to heat the interconnect device to a cross-linking temperature of the encapsulating material. 7. The m
    • thod of claim 1, wherein he enca
      • sulating material is applied in layers with a varying height across a surface of the electronic interconnect device. 8. The m
    • thod of claim 1, wherein he enca
      • sulating material is heated in the 3D printer prior to being applied.
See all independent claims <>

Description

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a filing under 35 U.S.C. § 371 of International Patent Application PCT/EP2015/056331, filed Mar. 25, 2015, and claims the priority of German Patent Application 10 2014 207 633.1, filed Apr. 23, 2014. These applications are incorporated by reference herein in their entireties.

BACKGROUND

It is known, in particular for creating a motor vehicle control device, to provide a populated printed circuit board with one or more housing elements, which encompass the components on one of the two sides of the printed circuit board.

For protection against environmental effects, electronic interconnect devices are placed in a housing. A housing element of this type is made of, e.g. aluminum, plastic or a similarly suitable material. It is also known from the prior art that the housing is formed using a molding compound, wherein the circuit module is coated with the molding compound in a coating process. Among other things, it is required of a housing for an electronic circuitry that it protect the electronic circuitry from mechanical and climatic effects. Moreover, the electronic circuitry should be protected in housings from dust, foreign matter, and liquids.

When a molding compound is used as the housing, there are disadvantages with regard to processing and material costs. Furthermore, a great deal of effort is required to optimally place the molding compound in an appropriate injection tool.

The object of the present disclosure is to provide a simple and inexpensive method, with which an electronic interconnect device can be at least partially protected from environmental effects. A further object of the present disclosure is to provide a corresponding electronic circuit module.

SUMMARY

The present disclosure is based on a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device is populated thereby with at least one electronic component, wherein the interconnect device and the at least one electronic component are covered in a material-bonded manner, at least in sections, with an encapsulating material. Furthermore, an electronic interconnect device is understood to be a combination of electrical, and in particular electronic, components (e.g. diodes and transistors) to form an assembly on a printed circuit board. The encapsulating material can thus cover sections of the printed circuit board as well as sections of the electronic components disposed thereon. As a result, it is ensured that no moisture from the exterior ends up on contact points on the printed circuit board, or the electronic components.

The embodiments present disclosure are distinguished in that in a first method step, and electronic interconnect device may be provided. In another step, the encapsulating material may be applied to the electronic interconnect device by means of a 3D printing process.

The encapsulating material may be a plastic, e.g. epoxy resin, which is normally used in a 3D printing process.

One advantage of the method is that it makes an inexpensive coating (encapsulation) of the interconnect device possible. Furthermore, the method is flexible with respect to different arrangements of electronic components on electronic interconnect devices. The method can thus be quickly and easily adapted to the respective electronic interconnect devices that are to be treated.

In one embodiment of the present disclosure, the encapsulating material is melted in the 3D printing process, and applied to the electronic interconnect device in drops or layers. This enables a precise and material conserving encasing of the electronic interconnect device.

In one embodiment of the present disclosure, the electronic interconnect device is heated to the cross-linking temperature of the encapsulating material. For practical purposes, the heating occurs in a step prior to the application of the encapsulating material to the interconnect device. The cross-linking temperatures of the different materials for a 3D printing process are known from the prior art. The cross-linking temperature is the temperature thereby, at which the 3D printing material, thus the encapsulating material, bonds in an optimal manner to the substance, thus the electronic interconnect device.

In one embodiment of the present disclosure, the electronic interconnect device is cleaned by means of a washing process prior to applying the encapsulating material. In this manner, it is ensured that an optimal bond can be obtained between the encapsulating material and the electronic interconnect device.

The method according to the present disclosure can be used, in particular, in the production and treatment of sensors and/or control devices for motor vehicles, in particular in the production of transmission control devices for motor vehicles.

Another aspect of the present disclosure is based on a circuit module having a housing, wherein the circuit module has an electronic interconnect device, wherein the interconnect device is populated with at least one electronic component, and wherein the interconnect device and the at least one electronic component are covered in a material-bonded manner, at least in part, with an encapsulating material, such that the encapsulating material forms the housing. The embodiments of the present disclosure are distinguished in that the encapsulating material is a material that can be applied to the interconnect device by means of a 3D printing process.

In one embodiment of the present disclosure, the encapsulating material covers the interconnect device and the at least one electronic component on an upper and/or lower surface of the interconnect device, in sections or entirely, or the encapsulating material encompasses the interconnect device and the at least one electronic component entirely. The extent of the encapsulating material over the interconnect device can thus be adapted on an individual basis to the respective embodiment of the population of the interconnect device.

The electronic circuit module can be a control device or a part of a control device in a motor vehicle, in particular a control device for a transmission control in a motor vehicle.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments of the present disclosure shall be explained below based on the Figures. Therein:

FIG. 1 shows an exemplary construction for executing an 3D printing process according to the present disclosure, and

FIG. 2 shows the method sequence according to the present disclosure.

DETAILED DESCRIPTION

FIG. 1 shows an exemplary construction for executing a 3D printing process according to the present disclosure for producing a circuit module 10. An electronic interconnect device 1 of the circuit module 10 has an upper surface 2 and a lower surface 3. The upper surface 2 and the lower surface 3 are populated with electronic components 4. A nozzle 5 of a 3D printer 6 is disposed above the electronic interconnect device 1. This nozzle 5 can move in all spatial directions (directional arrows) in accordance with a known 3D printer 6. Alternatively or additionally, it is also possible for the interconnect device 1 to be disposed on a holding device 7, which can move the interconnect device 1 in all spatial directions (directional arrows). This holding device 7 can also be designed such that it serves as a heating plate for heating the interconnect device 1 to the desired cross-linking temperature of the printing material of the 3D printer. The printing material is located in a reservoir 8 provided in the 3D printer.

By way of example, a layer of an encapsulating material 9 is depicted on the upper surface 2 of the interconnect device 1. This encapsulating material, applied to the interconnect device 1, serves as a housing for the interconnect device 1. It can be seen that a further layer is applied by means of the 3D printing process in the region of the electronic components 4 on the upper surface 2 of the interconnect device 1, wherein the encapsulating material 9 is deployed from the nozzle 5 toward the upper surface 2 of the interconnect device. It is thus possible to apply the encapsulating material 9 locally, and to adapt the height of the respective layer to the local conditions of the electronic interconnect device 1, e.g. the height of an electronic component 4 with respect to an upper surface of the interconnect device 1.

In accordance with the prior art pertaining to 3D printing, a pretreatment or pre-heating of the material 9 that is to be printed occurs in the nozzle 5 of the 3D printer 6. This material 9 is subsequently applied to the interconnect device 1 via the nozzle 5 in drops or layers.

FIG. 2 shows an exemplary sequence of a method according to the present disclosure. In a first step 100, an electronic interconnect device is provided. Subsequently, in a further step 101, the interconnect device is cleaned of dust, etc. In a further step 102, the cleaned interconnect device is placed in a 3D printer. Subsequently, in a further step 103, the interconnect device is heated to a desired temperature, ideally to the cross-linking temperature of the printing medium (encapsulating material). In the subsequent printing process, in step 104, the encapsulating material is prepared in the 3D printer, in particular it is melted, and printed onto the interconnect device via a nozzle, in particular it is applied thereto.

REFERENCE SYMBOLS

  • 1 interconnect device
  • 2 upper surface
  • 3 lower surface
  • 4 electronic component
  • 5 nozzle
  • 6 3D printer
  • 7 holding device
  • 8 reservoir
  • 9 encapsulating material
  • 10 circuit module
  • 100 provision of an interconnect device
  • 101 cleaning of the interconnect device
  • 102 placement of the interconnect device in a 3D printer
  • 103 heating of the interconnect device
  • 104 printing of the interconnect device

Read more
PatSnap Solutions

Great research starts with great data.

Use the most comprehensive innovation intelligence platform to maximise ROI on research.

Learn More

Citation

Patents Cited in This Cited by
Title Current Assignee Application Date Publication Date
Method of producing an electronic device and electronic device CONTINENTAL AUTOMOTIVE GMBH 26 March 2003 04 December 2003
Method of conformal coating using noncontact dispensing NORDSON CORPORATION,FANG, LIANG,QUINONES, HORATIO 14 October 2004 19 May 2005
Device, system, and method of three-dimensional printing SHINAR, ZOHAR,VIDAL, JOEL 12 January 2014 16 July 2015
Electronic apparatus and method for making the same SIEMENS AKTIENGESELLSCHAFT 27 March 2003 08 October 2003
Method of discrete conformal coating SPECIALTY COATING SYSTEMS, INC. 05 February 1993 10 August 1994
See full citation <>

More like this

Title Current Assignee Application Date Publication Date
Protective shell, electronic device, electronic speed regulator and unmanned aerial vehicle SZ DJI TECHNOLOGY CO., LTD. 02 November 2016 07 December 2017
Electronic device DENSO CORPORATION 30 March 2017 19 October 2017
Printed circuit board and electronic device having same BOE TECHNOLOGY GROUP CO., LTD. 12 August 2016 27 July 2017
Electronic device and method for manufacturing the same SAMSUNG ELECTRONICS CO., LTD. 15 February 2017 24 August 2017
Electronic circuit board, laminated board, and method for manufacturing electronic circuit board OLYMPUS CORPORATION 25 June 2015 29 December 2016
Small pitch direct view display and method of making thereof DEEMAN, NEIL,JANSEN, MICHAEL,LEE, HYUNG-CHUL,LIU, KAI,OKUI, KAZUNORI 21 April 2017 26 October 2017
Electronic device and heat spreader RICOH COMPANY, LTD.,MURAMATSU, KOICHI 09 May 2016 24 November 2016
Electronic device including shield structure SAMSUNG ELECTRONICS CO., LTD. 14 December 2016 22 June 2017
See all similar patents <>

More Patents & Intellectual Property

PatSnap Solutions

PatSnap solutions are used by R&D teams, legal and IP professionals, those in business intelligence and strategic planning roles and by research staff at academic institutions globally.

PatSnap Solutions
Search & Analyze
The widest range of IP search tools makes getting the right answers and asking the right questions easier than ever. One click analysis extracts meaningful information on competitors and technology trends from IP data.
Business Intelligence
Gain powerful insights into future technology changes, market shifts and competitor strategies.
Workflow
Manage IP-related processes across multiple teams and departments with integrated collaboration and workflow tools.
Contact Sales
Clsoe
US10064279 Method protecting electronic 1 US10064279 Method protecting electronic 2